• The pSCT camera will be equipped with 25 sensor modules, forming a “backplane” –

(1)

• The pSCT camera will be equipped with 25 sensor modules, forming a “backplane”

– each module consists of 64 SiPM sensors segmented in 4 independent SiPM carriers (“PCBs”),

connected to a dedicated TARGET7-based module, that communicates with a high-speed backplane.

• The INFN effort, agreed with the SCT community, is to provide at least 25 sensor modules, i.e.

100 PCBs, each housing 16 SiPMs, for a total of 1600 SiPMs.

– Actually only 16 out of 25 modules will be mounted, leaving room for 9 additional modules to be mounted in the next year

• The module and mechanical design and the front-end electronics were adapted to equip the focal plane of the Prototype Schwarzschild-Couder Telescope (pSCT), which will be operated at the VERITAS site in Arizona in 2017.

SiPM = 6,24 x 6,24

Dimensioni Modulo = 53,8 x 53,8 Spazio x Bonding= 0,51 Passo di ripetizione = 6,75 Distanza SiPM-bordo = 0,16

A4

V.Postolac he

R1

CTA MODULE

PESO: $PRPSHEET:{Peso}

$PRPSHEET:{Fine}

FR4 MODULE 6 x 6 x SiPM Separati

FOGLIO 1 DI 1 SCALA:2:1

N. DISEGNO TITOLO:

REVISIONE NON SCALARE IL DISEGNO

MATERIALE:

DATA FIRMA

INFN PERUGIA

DISEGNATO

SBAVATURA E BORDI NETTI INTERRUZIONE DEI

NO ME

VERIFIC ATO APPROVATO FATTO

FINITURA:

ANGOLARE:

QUALITA' SE NO N SPECIFICA TO:

QUOTE IN MILLIMETRI FINITURA SUPERFICIE:

TOLLERANZE:

LINEARE:

15/02/2016

6,24

0,16 6,24

0,51

6,75

53,80

0,51

53,80

0,16

(2)

SiPM 6x6 Step Repet 6,75 TITOLO:07/03/2016 R1

I.N.F .N. P ERU GIA

DISEGNATOVERIFICATOAPPROVATO INTERRUZIONE DEI

LINEARE:

PESO: $PRPSHEET:{Peso} A3

CTA MO DULE

FATTOQUALITA' $PRPSHEET:{Fine}

ANGOLARE: FINITURA:

TOLLERANZE: BORDI NETTI

NOMEFIRMADATA

MATERIALE: NON SCALARE IL DISEGNOREVISIONE

FR4 N. DISEGNO

SCALA:2:1FOGLIO 1 DI 1 SE NON SPECIFICATO:QUOTE IN MILLIMETRIFINITURA SUPERFICIE: SBAVATURA E

PCB_Mod_6x6_Simetrico V.Postolache A

6,75 Step Repet

6,75 Step Repet 0,10 0,30

53,80 0,16

53,80

0,51

0,16 6,24 0,11 0,51

53,80

1,51

BBONDING PAD SCALA 10 : 1 DETTAGLIO B BONDING PAD

SiPM 6x6

DETTAGLIO A SCALA 10 : 1

2,27 1,70

0,30 0,30

0,16

0,51 0,10 0,11

2,27

6,24

64 FBK 6x6mm2

25.80 mm

53.80 mm

2 x 25.80 mm = 51.6 mm

~ 2 x 25.8

0 mm = ~ 51.6 mm

Module unit: formed by 4 independent quadrants (“PCB”)

Quadrants (”PCB”)

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• A copper block is used to thermally and mechanically couple the PCB to the camera pods to form a module in a backplane

• It is placed on the PCB back-side with high precision in both X, Y and Z coordinates, before the

SiPM placement. This is crucial for the performance of the camera.

• More than 100 copper blocks are available for the assembly

• The requirements for alignment precision are of ~300 mm in XY plane and < 2° in z (vertical) axis

• Custom mechanical holders are

being produced with holes and

position pins to achieve a high

accuracy for the alignment (~10

mm) in the xy plane and z direction

(<0.1°).

(4)

Perugia activity progress

• Jig for SiPM gluing, bonding and transport

– 2 ready: metrology to be done – 2 to be done in Perugia workshop

• Board fabrication and assembly

– 100 final boards ready by Artel srl

– Components and copper blocks soldered – Metrology done

– Continuity test to be done

• SiPM

– Cca 2500 pcs in Perugia

– Single sipm storage box fabrication: 11/25 ready in Perugia workshop

• SiPM assembly start: second half of September

6

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Livello SiPM

5

9

1,84

9

102

14 9 120

380

5 0,80 9 14

1,84 120

380 B

B A A

UNI EN 22768-1-f per quote senza tolleranzaUNI EN 22768-1-f

27/ 06/ 2016

01 Gluing &Bonding JIG_03 CTA_SiPM_Module

+/ - 0.01 mm. per quote dei fori

PESO : $PRPSHEET:{Peso}

{Fine}

Alluminio A2

FO G LIO 1 DI 1 SC ALA :1/ 1 N. DISEGNO TITOLO :

REVISIO NE NO N SC ALA RE IL DISEG NO

M ATERIALE:

05/ 07/ 2016 V.Postolache

FIRMA NO ME

INTERRUZIO NE DEI

DATA PROG ETTATO

Q UALITA ' FATTO

SBAVA TURA E BO RDI NETTI FINITURA:

A NG O LARE:

R1 I.N.F.N.PERUGIA

V.Postolac he DISEG NATO VERIFIC ATO A PPRO VATO SE NON SPEC IFIC ATO:

Q UOTE IN MILLIM ETRI FINITURA SUPERFIC IE:

TOLLERANZE:

LINEARE:

UNI EN 22768-1-f per quote senza tolleranza SEZIONE A-A

SC ALA 2 : 1

7

0,20

1,50

5,60 SEZIONE B-B

SC ALA 2 : 1 18,90

9

14

• The custom jigs to handle the PCB have been designed and are being produced at the PG mechanical workshop

• They have been designed such that up to 27 PCB can be hosted and assembled at the same time

• The jigs will be used to manage the PCBs in all the phases of assembly:

• To place the copper block on the backside, before SiPM placement

• To place SiPM chips with the pick&place machine

• To ship them around

• To bond the SiPMs to input/output lines

• To coat the SiPm surface with UV transparent resin

• Two pairs different jigs were built since the PCBs are of two different, symmetric types

(6)

Jig for SiPM gluing, bonding and transport - 2 ready

- 2 work in progress. Ready in one week

8

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Board mounting on gluing, bonding, transportation jigs.

(8)

(9)

- 100 Boards assembled at ARTEL srl with components and copper blocks (50 Left type and 50 Right type) - Metrology done: analysis in progress

- Electrical test in progress

Board fabrication and assembly

11

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Metrology Results

• Good results (8 out of 100 are bad)

• Some unexpected offsets and rotations must be analyzed

• Analysis still in progress

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SiPM: 2500 pcs in Perugia

18

The SiPM must be unglued from the wafer to the single sipm storage boxes

(17)

Electrical Qualification Tests

PCB multiplexer

Test Station

…

1

16

• After the assembly, the PCBs are electrically tested

• Tests are made using Semtek multiplexer with 16 channels connected through the PCB connector

• Circuit design ready, boards ready 5/9