• The pSCT camera will be equipped with 25 sensor modules, forming a “backplane”
– each module consists of 64 SiPM sensors segmented in 4 independent SiPM carriers (“PCBs”),
connected to a dedicated TARGET7-based module, that communicates with a high-speed backplane.
• The INFN effort, agreed with the SCT community, is to provide at least 25 sensor modules, i.e.
100 PCBs, each housing 16 SiPMs, for a total of 1600 SiPMs.
– Actually only 16 out of 25 modules will be mounted, leaving room for 9 additional modules to be mounted in the next year
• The module and mechanical design and the front-end electronics were adapted to equip the focal plane of the Prototype Schwarzschild-Couder Telescope (pSCT), which will be operated at the VERITAS site in Arizona in 2017.
SiPM = 6,24 x 6,24
Dimensioni Modulo = 53,8 x 53,8 Spazio x Bonding= 0,51 Passo di ripetizione = 6,75 Distanza SiPM-bordo = 0,16
A4
V.Postolac he
R1
CTA MODULE
PESO: $PRPSHEET:{Peso}
$PRPSHEET:{Fine}
FR4 MODULE 6 x 6 x SiPM Separati
FOGLIO 1 DI 1 SCALA:2:1
N. DISEGNO TITOLO:
REVISIONE NON SCALARE IL DISEGNO
MATERIALE:
DATA FIRMA
INFN PERUGIA
DISEGNATO
SBAVATURA E BORDI NETTI INTERRUZIONE DEI
NO ME
VERIFIC ATO APPROVATO FATTO
FINITURA:
ANGOLARE:
QUALITA' SE NO N SPECIFICA TO:
QUOTE IN MILLIMETRI FINITURA SUPERFICIE:
TOLLERANZE:
LINEARE:
15/02/2016
6,24
0,16 6,24
0,51
6,75
53,80
0,51
53,80
0,16
SiPM 6x6 Step Repet 6,75 TITOLO:07/03/2016 R1
I.N.F .N. P ERU GIA
DISEGNATOVERIFICATOAPPROVATO INTERRUZIONE DEI
LINEARE:
PESO: $PRPSHEET:{Peso} A3
CTA MO DULE
FATTOQUALITA' $PRPSHEET:{Fine}
ANGOLARE: FINITURA:
TOLLERANZE: BORDI NETTI
NOMEFIRMADATA
MATERIALE: NON SCALARE IL DISEGNOREVISIONE
FR4 N. DISEGNO
SCALA:2:1FOGLIO 1 DI 1 SE NON SPECIFICATO:QUOTE IN MILLIMETRIFINITURA SUPERFICIE: SBAVATURA E
PCB_Mod_6x6_Simetrico V.Postolache A
6,75 Step Repet
6,75 Step Repet 0,10 0,30
53,80 0,16
53,80
0,51
0,16 6,24 0,11 0,51
53,80
1,51
BBONDING PAD SCALA 10 : 1 DETTAGLIO B BONDING PAD
SiPM 6x6
DETTAGLIO A SCALA 10 : 1
2,27 1,70
0,30 0,30
0,16
0,51 0,10 0,11
2,27
6,24
64 FBK 6x6mm2
25.80 mm
25.80 mm
53.80 mm
53.80 mm
2 x 25.80 mm = 51.6 mm
~ 2 x 25.8
0 mm = ~ 51.6 mm
Module unit: formed by 4 independent quadrants (“PCB”)
Quadrants (”PCB”)
• A copper block is used to thermally and mechanically couple the PCB to the camera pods to form a module in a backplane
• It is placed on the PCB back-side with high precision in both X, Y and Z coordinates, before the
SiPM placement. This is crucial for the performance of the camera.
• More than 100 copper blocks are available for the assembly
• The requirements for alignment precision are of ~300 mm in XY plane and < 2° in z (vertical) axis
• Custom mechanical holders are
being produced with holes and
position pins to achieve a high
accuracy for the alignment (~10
mm) in the xy plane and z direction
(<0.1°).
Perugia activity progress
• Jig for SiPM gluing, bonding and transport
– 2 ready: metrology to be done – 2 to be done in Perugia workshop
• Board fabrication and assembly
– 100 final boards ready by Artel srl
– Components and copper blocks soldered – Metrology done
– Continuity test to be done
• SiPM
– Cca 2500 pcs in Perugia
– Single sipm storage box fabrication: 11/25 ready in Perugia workshop
• SiPM assembly start: second half of September
6
Livello SiPM
5
9
1,84
9
102
14 9 120
380
5 0,80 9 14
1,84 120
380 B
B A A
UNI EN 22768-1-f per quote senza tolleranzaUNI EN 22768-1-f
27/ 06/ 2016
01 Gluing &Bonding JIG_03 CTA_SiPM_Module
+/ - 0.01 mm. per quote dei fori
PESO : $PRPSHEET:{Peso}
{Fine}
Alluminio A2
FO G LIO 1 DI 1 SC ALA :1/ 1 N. DISEGNO TITOLO :
REVISIO NE NO N SC ALA RE IL DISEG NO
M ATERIALE:
05/ 07/ 2016 V.Postolache
FIRMA NO ME
INTERRUZIO NE DEI
DATA PROG ETTATO
Q UALITA ' FATTO
SBAVA TURA E BO RDI NETTI FINITURA:
A NG O LARE:
R1 I.N.F.N.PERUGIA
V.Postolac he DISEG NATO VERIFIC ATO A PPRO VATO SE NON SPEC IFIC ATO:
Q UOTE IN MILLIM ETRI FINITURA SUPERFIC IE:
TOLLERANZE:
LINEARE:
UNI EN 22768-1-f per quote senza tolleranza SEZIONE A-A
SC ALA 2 : 1
7
0,20
1,50
5,60 SEZIONE B-B
SC ALA 2 : 1 18,90
9
9
14
• The custom jigs to handle the PCB have been designed and are being produced at the PG mechanical workshop
• They have been designed such that up to 27 PCB can be hosted and assembled at the same time
• The jigs will be used to manage the PCBs in all the phases of assembly:
• To place the copper block on the backside, before SiPM placement
• To place SiPM chips with the pick&place machine
• To ship them around
• To bond the SiPMs to input/output lines
• To coat the SiPm surface with UV transparent resin
• Two pairs different jigs were built since the PCBs are of two different, symmetric types
Jig for SiPM gluing, bonding and transport - 2 ready
- 2 work in progress. Ready in one week
8
Board mounting on gluing, bonding, transportation jigs.
- 100 Boards assembled at ARTEL srl with components and copper blocks (50 Left type and 50 Right type) - Metrology done: analysis in progress
- Electrical test in progress
Board fabrication and assembly
11
Metrology Results
• Good results (8 out of 100 are bad)
• Some unexpected offsets and rotations must be analyzed
• Analysis still in progress
SiPM: 2500 pcs in Perugia
18
The SiPM must be unglued from the wafer to the single sipm storage boxes
Electrical Qualification Tests
PCB multiplexer
Test Station
…
1
16
• After the assembly, the PCBs are electrically tested
• Tests are made using Semtek multiplexer with 16 channels connected through the PCB connector
• Circuit design ready, boards ready 5/9