BIBLIOGRAFIA Bibliografia 95

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Bibliografia

95

BIBLIOGRAFIA

[1] ESA COLP-507b-LS-I:

R.Cancedda “Bone Marrow Stromal Cell Differentiation in Microgravity” [2] NASA’s Bioreactor:

http://www1.jsc.nasa.gov/er/seh/cell_growth_in_zero_g.pdf [3] PIC16F88 Datasheet, Microchip Tecnology

[4] LM317 Datasheet, National Semiconductor [5] FDC645N Datasheet, Fairchild Semiconductor [6] MM74HC126M Datasheet, Fairchild Semiconductor [7] Kubik accommodation handbook, KUB-COM-HBOOK [8] STROMA, KI-STR-RP-004

[9] Waram Tom: Actuator Design Using Shape Memory Alloys [10] Gilbertson Roger: Muscle Wires project book

[11] Flexinol Muscle Wire Datasheet [12] Velázquez Ramiro, Pissaloux Edwige:

Design of Shape Memory Alloy Helical Springs Using Force and Time Response Criteria [13] Helical Spring Design:

http://www.engrasp.com/doc/etb/mod/stat1/spring/spring_help.html

[14] Shape Memory Alloys:

http://www.jmmedical.com/html/_shape_memory_alloys_.html

http://www.mtm.kuleuven.ac.be/Research/ADAPT/publicat/ShapeMemory/smatext.htm

[16] Shape Memory Alloy:

http://www.cs.ualberta.ca/~database/MEMS/sma_mems/sma.html

[17] Shape Memory Alloys :

http://www.jmmedical.com/html/_shape_memory_alloys_.html

http://www.mtm.kuleuven.ac.be/Research/ADAPT/publicat/ShapeMemory/smatext.htm

[19] Schubert John:

http://www.montana.edu/etd/available/unrestricted/Schubert_0805.pdf

[20] Leghe a memoria di forma:

http://www.ing.unitn.it/~colombo/APPLICAZIONE_DELLE_LEGHE_A_MEMORIA_DI_FOR MA/inizio.html#indice

[21] The Austenitic Start and Finish Temperature of a Ni55Ti55 Compression Spring: http://www2.sjsu.edu/faculty/selvaduray/page/papers/mate210/compression.pdf

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Bibliografia

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Practical Design Techniques for Sensor Signal Conditioning, Bridge Circuits

[23] Derek Dunlap, Haiyong Li:

The Austenitic Start and Finish Temperature of a Ni55Ti45 Compression Spring [24] A..Nannini,P.Bruschi: Sensori e rivelatori, terza edizione, SEU

[25] TCA Datasheet: http:

//www.aep.it/AEPtransducers/Data_Sheet/TCA.315.R3.pdf [26] AD624 Datasheet, Analog Devices

[27] AD587 Datasheet, Analog Devices [28] OP400 Datasheet, Analog Devices

[29] FDC645N Datasheet, Fairchild Semiconductor

[30] Grounding and Shelding Considerations for Thermocouples, Strain Gages, and Low-Level Circuits: http://www.iotech.com/catalog/techtip/TechTip_60201.pdf

[31] BBX-6 Experiment Units for OCLAST for FOTON-M3. ESA RFQ 3-11686/NL/FC, 4 Maggio 2006