[3] J.C. Eloy, Status of the MEMS industry 2008, 2008, MIS 08, Yole Développement report

(1)

Bibliografia:

[1] V. Russino, Tesi di laurea, Progetto e tecnologia di fabbricazione di un dispositivo MEMS magnetico per "energy scavenging", 2007, Università degli studi di Pisa

[2] F.Chollet, HB. Liu, A (not so) short Introduction to Micro Electromechanical Systems, version 2.5, 2008, http://memscyclopedia.org

[3] J.C. Eloy, Status of the MEMS industry 2008, 2008, MIS 08, Yole Développement report

[4] M. Potin, MEMS Accelerometers and Gyroscopes Market, 2007, Yole Développement report

[5] J. Walko, ST leads the consumer charge in MEMS accelerometers, 2009, EE Times Europe

[6] J. Bouchaud, R. Dixon, MEMS Market Brief, volume 2 issue 1, 2009, iSuppli Corporation

[7] J. Bouchaud, R. Dixon, Economic crisis accelerates transformation of the MEMS industry, 2009, iSuppli Corporation

[8] Semiconductor International's Staff, Yole Ranks Top 30 MEMS Suppliers;

Sees Rapid Growth in Consumer, Medical, 2008, http://www.semiconductor.net

[9] H. Xie, Integrated monolithic tri-axial micromachined accelerometer, 2007, United States Patent, Patent n° 7,258,012 b2,

http://www.freepatentsonline.com

[10] W. Zhou, W. H. Liao, W. J. Li, Analysis and design of a self-powered

piezoelectric microaccelerometer, 2005, Hong Kong University

[11] Analog Devices iMEMS® Accelerometers,

(2)

[12] STMicroelectronics Accelerometers,

http://www.st.com/stonline/products/families/sensors/accelerometers.htm [13] Colibrys MS9000.D Accelerometer,

http://www.colibrys.com/files/pdf/products/PD%20MS9000D

%2030D.MS9X.C.12.08.pdf

[14] Texas Instruments 3PP8 Series Hermetic Pressure Transducer, http://ece.uprm.edu/~s016965/micro2/Other%20PDFs/ipt-3pp8.pdf [15] http://www.sensorland.com/HowPage059.html

[16] GE Thermometrics Technologies Thermopile,

http://www.thermometrics.com/assets/images/thermopile.pdf [17] A. Graf, M. Arndt, G. Gerlach, Seebeck’s effect in micromachined

thermopiles for infrared detection. A review, 2007, Proc. Estonian Acad.

Sci. Eng.

[18] M. A. Dubois, Thin film bulk acoustic wave resonators: a technology overview, 2007, MEMSWAVE 03, Toulouse, France, 2003

[19] K. W. Kim, M. G. Gu, J. G. Yook, H. K. Park, Resonator Size Effects on the TFBAR Ladder Filter Performance, 2003, IEEE Microwave and Wireless Components Letters, VOL. 13, NO. 8

[20] C. M. Beck, M. M. Ahmed, C. J. Brierley, A. P. Needham, S. P. Marsh, Microwave Filters and Switches produced using Micro-machining Techniques, 2000, Marconi Caswell Ltd UK

[21] W. Xiaobao, Q. Jin, Z. Dacheng, Design, fabrication, testing and mechanical analysis of Bulk-Micromachined Flowmeters, 2004, Acta Mechanica Sinica, Vol.20, No.2

[22] D. Javan, E. Abbaspour, Design and Simulation of a Micromachined Gas Flow meter, Urmia University, Iran

[23] OMRON's MEMS Flow Sensor,

http://www.omron.com/ecb/products/sensor/flow_prin.html [24] Sensirion, Mass Flow Control with CMOSens®,

http://www.sensirion.ch/en/06_cmosens_technology/03_gas_flow.htm

(3)

[25] Sercalo SW Series, MEMS Optical Switches,

http://www.sercalo.com/document/PDFs/DataSheets/SW%20MM

%20DataSheet.pdf

[26] M. F. Tung, An Introduction to MEMS Optical Switches, 2001, School of Electrical and Computer Engineering, Cornell University

[27] Micralyne

^®

, Silicon Optical Bench,

http://www.scribd.com/doc/3341938/Silicon-Optical-Bench-Micralyne- MEMS-Foundry

[28] D. Jourdan, MEMS energy harvesting devices, great technology: For which markets?, 2008, Micronews, issue n° 73

[29] P. D. Mitcheson, G. K. Rao, T. C. Green, Energy Harvesting From Human and Machine Motion for Wireless Electronic Devices, 2008, Vol. 96, No. 9, Proceedings of the IEEE

[30] N. El Ghouti, A. Schmitz, T. Sterken, R. J. M. Vullers, Piezoelectric energy scavengers for wireless autonomous transducer solutions, 2006, project SBO 030288 “Power MEMS”, pp. 384-8

[31] E. O. Torres, G. A. Rincón-Mora, Electrostatic Energy Harvester and Li-Ion Charger Circuit for Micro-Scale Applications, 2006, 49th IEEE International Midwest Symposium on Circuits and Systems

[32] G. Altena, T. Sterken, P. Fiorini, R. J. M. Vullers and R. Puers, Electrostatic energy scavengers for wireless autonomous transducer solutions, 2006, SAFE Conference, Verona

[33] S. P. Beeby, M. J. Tudor and N. M. White, Energy harvesting vibration sources for microsystems applications, 2006, Meas. Sci. Technol. 17 (2006) R175–R195 IOP Publishing

[34] C. Serre, A. P. Rodriguez, Vibrational energy scavenging with Si technology electromagnetic inertial microgenerators, 2006, DTIP of MEMS &

MOEMS, Stresa, Italy

[35] A. Diligenti, A. Nannini, Materiali e tecnologie per la microelettronica, Vol.

1, SEU Pisa

(4)

[36] TimeDomain CVD, Inc., Thermal CVD of Silicon Nitride,

http://timedomaincvd.com/CVD_Fundamentals/films/SiN_thermal_CVD.ht ml

[37] C. Zhiqiang, Z. Tong-Yi, Z. Xin, Microbridge testing of plasma-enhanced chemical-vapor deposited silicon oxide films on silicon wafers, 2005, Journal of Applied Physics, Volume 97, Issue 10, pp. 104909-104909-9 [38] MIT education Material Property Database, LPCVD Silicon Dioxide,

http://www.mit.edu/~6.777/matprops/lpcvd_sio2.htm

[39] MIT education Material Property Database, Thermal Silicon Dioxide, http://www.mit.edu/~6.777/matprops/sio2.htm

[40] MIT education Material Property Database, PECVD Silicon Nitride, http://www.mit.edu/~6.777/matprops/pecvd_sin.htm

[41] N. Sabaté, J. Santander, I. Gracia, L. Fonseca, E. Figueras, E. Cabruja, C.

Cané, Characterization of thermal conductivity in thin film multilayered membranes, 2005, Thin Solid Films 484 pp. 328– 333, Elsevier B.V.

[42] S. Udina, M. Carmona, G. Carles, J. Santander, L. Fonseca, S. Marco, A micromachined thermoelectric sensor for natural gas analysis: Thermal model and experimental results, 2008, Sensors and Actuators B 134, pp.

551–558, Elsevier B.V.

[43] N. J. Choi, Y. S. Lee, J. H. Kwak, Chemical warfare agent sensor using MEMS structure and thick ﬁlm fabrication method, 2005, Sensors and Actuators B 108 pp. 177–183, Elsevier B.V.

[44] I. Elmi, S. Zampolli, G.C. Cardinali, Optimization of a wafer-level process for the fabrication of highly reproducible thin-ﬁlm MOX sensors, 2008, Sensors and Actuators B 131 pp. 548–555, Elsevier B.V.

[45] J. Cerdà Belmonte, J. Puigcorbé, J. Arbiol, A.Vilà, J.R. Morante, N. Sabaté, I. Gràcia, C. Cané, High-temperature low-power performing

micromachined suspended micro-hotplate for gas sensing applications,

2006, Sensors and Actuators B 114 pp. 826–835, Elsevier B.V.

(5)

[46] I. Elmi, S. Zampolli, E. Cozzani, F. Mancarella, G. C. Cardinali,

Development of ultra-low-power consumption MOX sensors with ppb-level VOC detection capabilities for emerging applications, Sensors and

Actuators B 135 pp. 342–351, Elsevier B.V.

[47] I. Y. Huang, M. C. Lee, Y. W. Chang, Development of a Novel Flexural Plate Wave Biosensor for Immunoglobulin-E Detection by Using SAM and MEMS Technologies, 2006, IEEE Sensors EXCO, Daegu, Korea

[48] B. T. Cunningham, J. Williams, Flexural Plate sensor and array, 2005, United States Patent, Patent n° 6,851,297 b2,

http://www.freepatentsonline.com

[49] S. Zhang, L. Xia, C. H. Kang, G. Xiao, S. M. Ong, Y. C. Toh, H. L. Leo, D.

v. Noort, S. H. Kan, H. H. Tang, H. Yu, Microfabricated silicon nitride membranes for hepatocyte sandwich culture, 2008, Biomaterials 29 pp.

3993–4002, Elsevier Ltd

[50] W. M. Zhang, J. Li, L. X. Cao, Y. G. Wang, W. Guo, K. X. Liu, J. M. Xue, Fabrication of nanoporous silicon dioxide/silicon nitride membranes using etched ion track technique, 2008, Nuclear Instruments and Methods in Physics Research B 266 pp. 3166–3169, Elsevier B.V.

[51] D. S. Lee, H. G. Choi, K. H. Chung, B. Y. Lee, H. C. Yoon, Fabrication of an integrated microﬂuidic device based on a heat-sensitive poly(N-

isopropylacrylamide) polymer and micromachining protocols for

programmed bio-molecular patterning, 2007, Sensors and Actuators B 130 pp. 150–157, Elsevier B.V.

[52] D. S. Lee, H. G. Choi, K. H. Chung, B. Y. Lee, H. B. Pyo, H. C. Yoon, A Temperature-Controllable Microelectrode and Its Application to Protein Immobilization, 2007, ETRI Journal, Volume 29, Number 5, pp. 667-669 [53] C. L. Dai, J. Y. Hong, M. C. Liu, High Q-factor CMOS-MEMS inductor,

2008, DTIP of MEMS & MOEMS, EDA Publishing

[54] M. Garcìa, R. Ambrosio, A. Torres, A. Kosarev, IR bolometers based on

amorphous silicon germanium alloys, Journal of Non-Crystalline Solids pp.

(6)

[55] W. S. Lee, Y. C. Kim, J. S. Lee, S. W. Lee, S. S. Lee, Fabrication of Circular Diaphragm for Piezoelectric Acoustic Devices, Journal of Semiconductor Technology and Science, Vol.5, N°.1, pp. 52-57

[56] Y. R. Kang, S. C.Kang, K. K. Paek, Y. K. Kim, S. W. Kim, B. K. Ju, Air-gap type ﬁlm bulk acoustic resonator using ﬂexible thin substrate, 2004, Sensors and Actuators A 117 pp. 62–70, Elsevier B.V.

[57] Si-Mat, Silicon Materials glossary,

http://www.si-mat.com/en/pages/glossary/crystal_bulk.php

[58] P. Pal, K. Sato, M. A. Gosalvez, M. Shikida, New Types of MEMS Structures Using CMOS Anisotropic Compatible Etchants, 2007, Nagoya University [59] K. Biswas, S. Das, D. K. Maurya, S. Kal, S. K. Lahiri, Bulk micromachining

of silicon in TMAH-based etchants for aluminum passivation and smooth surface, 2005, Microelectronics Journal 37, Elsevier Ltd

[60] P. M. Sarro, D. Brida, W. v. d. Vlist, S. Brida, Effect of surfactant on surface quality of silicon microstructures etched in saturated TMAHW solutions, 1999, Sensors and Actuators 85, Elsevier Science S.A.

[61] P. M. Sarro, S. Brida, C. M. A. Ashruf, W. v. d. Vlist, H. v. Zeijl, Anisotropic Etching of Silicon in Saturated TMAHW Solutions for IC- Compatible Micromachining, 1998, Sensors and materials, Myu, Tokyo [62] K. Biswas, S. Kal, Etch characteristics of KOH, TMAH and dual doped

TMAH for bulk micromachining of silicon, 2005, Microelectronics Journal 37, Elsevier Ltd

[63] C. R. Yang, P. Y. Chen, C. H. Yang, Effects of various ion-typed surfactants on silicon anisotropic etching properties in KOH and TMAH solutions, 2004, Sensors and Actuators A 119, Elsevier B.V.

[64] Virginia Semiconductor, Inc., Wet-Chemical Etching and Cleaning of Silicon, 2003, Fredericksburg, VA

[65] T. Abe, W. C. Messnel, M. L. Reed, Effective Methods to Prevent Stiction During Post-Release-Etch Processing, 1995, IEEE

[66] L.Concialdi, Tesi di laurea, Caratterizzazione e ottimizzazione del progetto

(7)

[67] C. R. Yang, P. Y. Chen, C. H. Yang, Study on anisotropic silicon etching characteristics in various surfactant-added tetramethyl ammonium hydroxide water solutions, 2005, Journal of Micromechanics and Microengineering, IOP Publishing Ltd

[68] G. Yuan, P. C.H. Chan, I-M. Hsing, R.K. Sharma, J. K.O. Sin, and Y.Y.

Wang, An improved TMAH Si-etching solution without attaching exposed aluminum, 2001, Sensors and Actuators A 89, pp. 135-141

[69] E. Steinsland, T. Finstad, A. Hanneborg, Etch rates of (100), (111) and (110) single-crystal silicon in TMAH measured in situ by laser reflectance

interferometry, 2000, Sensors and Actuators, 86, pp. 73-80