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22) V. Székely, Cs. Márta, M. Rencz, G. Végh, Zs. Benedek, S. Török: A thermal benchmark chip:

design and applications. IEEE Transactions on Components, Packaging and Manufacturing technology, Part A, Sept. 1998, Vol. 21, No. 3, pp. 399-405

23) V. Székely, M. Rencz, B. Courtois: Application results of a new thermal benchmark chip, Proceedings of the SEMI-THERM Symposium, 1998, March 1998, San Diego, USA

24) V. Székely, M. Rencz, B. Courtois: Thermal Transient Testing Without a Tester, Proceedings of SEMICON West'98, 13-17 July, 1998, San Jose, USA, Proceedings, pp. D1-10/Section II.

25) A. Poppe, G. Farkas, M. Rencz, Zs. Benedek, L. Pohl, V. Székely, K. Torki, S. Mir, B. Courtois:

Design of a scalable multi-functional thermal test die with direct and boundary scan access for programmed excitation and measurement data acquisition. Proceedings of the 6th THERMINIC Workshop, 24-27 September, Budapest, Hungary, pp. 267-272

26) P.E.Bagnoli, E.Dallago, A.Maierna, S.Di Pascoli, D.Provenzano, G.Venchi: IMS tecnology for automotive applications. Proceedings of 11 European Microelectronics Conference 1997 Venice, Italy

27) G.Oliveti, A.Piccirillo, P.E.Bagnoli: Analysis of laser diode thermal properties with spatial resolution by means of the TRAIT method. MICROELECTRONICS JOURNAL 1997

28) P.E.Bagnoli, C.Casarosa, M.Ciampi, E.Dallago: Thermal Resistance Analysis by Induced Transient (TRAIT) method for power electronic devices thermal characterization. PART I : fundamentals and theory. IEEE TRANSACTIONS ON POWER ELECTRONICS 1998;

29) P.E.Bagnoli, C.Casarosa, E.Dallago, M.Nardoni: Thermal Resistance Analysis by Induced Transient (TRAIT) method for power electronic devices thermal characterization. PART II : practice and experiments. IEEE TRANSACTIONS ON POWER ELECTRONICS 1998;

30) S.DiPascoli, P.E.Bagnoli, C.Casarosa: Thermal Properties of Insulated Metal Substrate Technology. MICROELECTRONICS JOURNAL 1999

31) L.Pellegrino, P.E.Bagnoli, M.Madella, A.Piccirillo: Spatially resolved thermal characterization of packaged Vertical Cavity Surface-Emitting lasers. THERMINIC 98 Cannes, Francia

32) S.Di Pascoli, P.E.Bagnoli, C.Casarosa: Temperature transient measurements in electronic devices for spatially resolved thermal characterization. IMEKO TC-4 Symposium on Development in Digital Measuring Instrumentation. 1998 Napoli, Italia

33) P.E. Bagnoli , C. Casarosa , E. Dallago , G. Venchi: Thermal analysis of packaged power devices. Thermal analysis of packaged power devices. 1999 Losanna, Svizzera

34) P.E. Bagnoli , S. Di Pascoli: Characterisation of conductive heat transfer in electronic device-

packages solid systems. 35TH National Heat Transfer Conference June 10-12, 2001, Anaheim,

California. 2001 Anaheim, California, U.S.A.