• Non ci sono risultati.

Micheal Widmer, ‘Capillary Electrophoresis and Sample Injection Systems Integrated on a Planar Glass Chip’, Anal

N/A
N/A
Protected

Academic year: 2021

Condividi "Micheal Widmer, ‘Capillary Electrophoresis and Sample Injection Systems Integrated on a Planar Glass Chip’, Anal"

Copied!
4
0
0

Testo completo

(1)

_ _ 120

BIBLIOGRAFIA

[1] http://www.vlsilab.polito.it [2] http://www.molecularlab.it [3] http://www.lab2000.com

[4] Lihua Zhang, Fuquan Dang, Yoshinobu Baba, ‘Microchip electrophoresis–

based separation of DNA’, J. Pharm. Biomed. Anal, 30 (2003) pp. 1645- 1654.

[5] D. Jed Harrison, Andreas Manz, Zhounghui Fan, Hans Lüdi, H. Micheal Widmer, ‘Capillary Electrophoresis and Sample Injection Systems Integrated on a Planar Glass Chip’, Anal. Chem. 64 (1992) pp. 1926-1932.

[6] Stephen C. Jacobson, Roland Hergenröder, Lance B. Koutny, J. Micheal Ramsey, ‘Open Channel Electrochormatography on a Microchip’, Anal.

Chem. 66 (1994) pp. 2369-2373.

[7] Yining Shi, Peter C. Simpson, James R. Scherer, David Wexler, Christine Skibola, Martyn T. Smith, Richard A. Mathies, ‘Radial Capillary Array Electrophoresis Microplate and Scanner for High-Performance Nucleic Acid Analysis’ Anal. Chem. 71 (1999) pp. 5354-5361.

[8] Franz von Heeren, Elisabeth Verpoorte, Andreas Manz, Wolfgang Thormann, ’Micellar Electrokinetic Chromatography Separations and

(2)

Bibliografia _

_ _ 121 Analyses of Biological Samples on a Cyclic Planar Microstructure’, Anal.

Chem. 68 (1996) pp. 2044-2053.

[9] Vladislav Dolník, Shaorong Liu, Stevan Jovanovich, ‘Capillary Electrophoresis on Microchip’, Electrophoresis 21 (2000) pp. 41-54.

[10] Steven A. Soper, Sean M. Ford, Shize Qi, Robin L. McCarley, Kevin Kelly, Micheal C. Murphy, ‘Polymetric Microelectromechanical Systems’, Anal. Chem. 72 (2000) pp.643-651.

[11] Yolanda Fintschenko, Albert van den Berg, ‘Silicon microtechnology and microstructures in separation science’, J. Chromatogr. A 819 (1998) pp. 3- 12.

[12] Masanori Ueda, Hiroaki Nakanishi, Osamu Tabata, Yoshinobu Baba,

‘Imaging of a band for DNA fragment migrating in microchannel on integrated microchip’, Materials science and engineering, C 12 (2003) pp.

33-36.

[13] http://www.biomemsrc.org/

[14] Ji-Yen Cheng, Meng-Hua Yen, Cheng-WeyWei, Yung-Chuan Chuang and Tai-Horng Young “Crack-free direct-writing on glass using a low-power UV laser in the manufacture of a microfluidic chip” J. Micromech.

Microeng. 15 (2005) 1147–1156 doi:10.1088/0960-1317/15/6/005

(3)

Bibliografia _

_ _ 122 [15] Minqiang Bu, Tracy Melvin, Graham J. Ensell, James S. Wilkinson, Alan G.R. Evans “A new masking technology for deep glass etching and its microfluidic application” Sensors and Actuators A 115 (2004) 476–482

[16] Elisabetta Zucchelli “Microlavorazione del vetro per la realizzazione di canali per elettroforesi capillare” Anno Accademico 2002/2003 pag 97 [17] http://www.precision-ceramics.co.uk/italiano/frm/index.htm

[18] Jean-Christophe Roulet, Reinhard Völkel, Hans Peter Herzig, Elisabeth Verpoorte, Nico F. de Rooij, René Dändliker, “Fabrication of Multilayer Systems Combining Microfluidic and Microoptical Elements for Fluorescence Detection”, Journal of microelectromechanical systems 10 (2001) pp. 482-491.

[19] Stefano Volpini, “Regolatore di flusso integrabile per applicazioni in campo spaziale”, Università degli studi di Pisa, Facoltà di Ingegneria, Cap 3,5.

[20] A. Berthold, L. Nicola, P.M. Sarro, M.J. Vellekoop, “Glass-to-glass anodic bonding with standard IC technology thin films as intermediate layers”, Sensors and Actuators 82 2000 224–228

[21] J. van Elp, P. T. M. Giesen, and J. J. van der Velde, “Anodic bonding using the low expansion glass ceramic Zerodur”, 2005 American Vacuum Society 96-98.

(4)

Bibliografia _

_ _ 123 [22] Jun Wei, Sharon M. L. Nai, C. K. Stephen Wong, Zheng Sun, and Loke

Chong Lee,” Low Temperature Glass-to-Glass Wafer Bonding”, IEEE TRANSACTIONS ON ADVANCED PACKAGING, VOL. 26, NO. 3, AUGUST 2003 289-294

[23] V.G. Kutchoukov , F. Laugere, W. van der Vlist, L. Pakula, Y. Garini, A.

Bossche,”Fabrication of nanofluidic devices using glass-to-glass anodic bonding”, Sensors and Actuators A 114 (2004) 521–527

[24] J. Wei, S.M.L. Nai, C.K. Wong, L.C. Lee,” Glass-to-glass anodic bonding process and electrostatic force”, Thin Solid Films 462–463 (2004) 487–

491

[25] Kirt R. Williams, Richard S. Muller, "Etch Rates for Micromachining Processing", Journal of Microelectromechanical System, Vol. 5. No. 4, December 1996 pag 256-269

[26] A. Diligenti, A. Nannini, “Materiali, Tecnologie e dispositivi per la microelettronica”, Vol. I pp. 117-118, pp. 125-126.

Riferimenti

Documenti correlati

As [ 8 ] points out, the traditional financial institutions are investing in FinTech in a variety of ways, including partnering with FinTechs or Technology companies,

Oltre a questi Ooms richiede altri dati accessori necessari per specificare diversi aspetti della soluzione delle equazioni, quali: comporti isotermo o presenza

Essa viene affermata anche nei manuali pratici citati in precedenza (ASL Brescia & Associazione Centro Natura Amica Onlus, 2010; Fondazione Iniziative zooprofilattiche

Ma forse il momento più decisivo del disgregamento della posizione morale del Presidente e dell’offuscamento del suo pensiero fu quando alla fine, con

Se admitiera o no la pertinencia del signo como objeto de la semiótica, Eco mantenía que, en cualquier caso, habría que coincidir en que la semiótica debía ocuparse de todo

Tale complessità burocratica rischia oggi di paralizzare l’attività produttiva agricola, date le restrizioni agli spostamenti imposte dal Governo a causa del

Il progetto “Le Mura Per Tutti “ si pone come finalità la realizzazione e la sperimentazione di un sistema di ausilio alla mobilità per persone non vedenti, sulla passeggiata

Rubin, Thermal characterization of power transistors, IEEE Transactions on Electron Devices, ISSN 0018-9383 , vol.. Ghione, Dispositivi per la microelettronica, McGraw-Hill,